The?"More reliable Coasting and Underfill Technology Seminar"?jointly organized by YST?Industrial Co., Ltd., YST New Materials Co., Ltd.,and YST?Solder Manufacturer?(Kunshan) Co., Ltd.was successfully?held in Dongguan and Suzhou on Aug.8?and Aug.15,2018?respectively.

Although the two seminars were held at different times, locations, and invited different guests, they focused on "more reliable Coating and Underfill Technology" that have?attracted widespread attention in the?industry. At the same time, the two conferences also introduced?some revolutionary new technologies and new products to the participants. Therefore, the industry attracted?a large number of participants. Alonging with the success of the conference, the two conferences were well received by the attendees.

YST two seminars both focused on how to improve electronic manufacturing processes, enhance product performance, and choose environmentally friendly, safe and reliable electronic materials. The experts from YST R & D team explained and analyzed to the guests. The participants not only had a clearer understanding of the future development trend of the industry, but also had a more comprehensive understanding of YST such as water based conformal coating,high flash point polyurethane coating,thixotropic polyurethane thick coating material,UV-dark curing conformal coating,UV-moisture dual curing conformal coating,underfill adhesive,double components underfill structural adhesive etc.,which can be widely used in various areas of circuit board protection products.These products can be widely used in electronics, intelligent industrial control, military aerospace, energy, automobile, security and other fields, its performance is in the industry leading level, in line with the future industry development trend.

Through the success of the two seminars held in Dongguan and Suzhou, we feel the YST industry influence and strong R & D strength. Up to now, YST?has participated in the drafting of six national standards and one industry standard, has passed the UL safety certification and 5 management system certification represented by IATF16949:2016, and has obtained 38 Chinese national invention patents.

In the future, with the upgrading of the global electronics packaging industry and the continuous acceleration of technological innovation, YST?will continue to work hard, firmly grasp the innovation breakthrough, lead the trend of R & D ideas will not waver. YST?will also take these two seminars an opportunity to build a mutually beneficial and win-win platform for the exchange of resources and information, and to work with colleagues in the industry to make greater contributions to promoting the upgrading of the electronics and assembly industry and technological innovation.